Phase-change materials for thermal management of electronic devices

The increase in power density of electronic devices, driven by the higher performance and miniaturization demands, has led researchers seek new and alternative thermal management techniques. Since most of the electronic devices often experience high frequency power cycles, cooling systems must also be capable of managing transient thermal profiles to delay the temperature response and reduce the temperature gradients within the device, which can cause thermal stresses and, in the long run, the failure of the electronic device. The integration of Phase-Change Materials (PCM) into heat sinks for electronic devices represents an interesting technique to increase the thermal inertia of the cooling system, while also ensuring more stable operating temperatures within the electronic components. However, several technical challenges still limit their commercial viability in electronic applications. The present …